PCB Assembly summarize

We can offer you surface mounting technology:

1. Component specification: LGA,CSP,BGA,TQFP,QFN,PLCC,SOT,SOIC
2. Process model: PCB assembly , Dual sides SMT , Dual Sides DIP
3. Standard chip size component: 0603 and larger
4. Minimum chip size component: 0201 
5. Pitch ICs : pitch minimum 0.2mm 
6. BGA Pin Count: 48pin~600pin
7. BGA Size:8x6mm~37x37mm

8. u-BGA Ball diameter: 0.2mm


Following information is requested for this service: 
1. BOM   (essential)
2. Gerber file   (essential)
3. Assembly drawing with any change notices   (if need)
4. Dimension specifications for non-standard components  (if need)
5. Test standard operation procedures  (if need)
Please offer us acceptable components for substitution so as to shorten the lead time,If possible, please send prototype sample board to us for further reference.